Open Cell Copper Foam

Material: copper, pure copper
Thickness: 0.1-35mm
Aperture: 0.1-10mm
Porosity: 60-98%, can be customized
Through porosity: ≥98%
Bulk density: 0.1-3.0g/cm3, can be customized
PPI (number of holes per inch): 5-150
Size: various sizes and shapes can be customized

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Description

Product Introduction

Open cell copper foam is a versatile new material with a three-dimensional structure and evenly distributed interconnected pores.
Its conductivity is superior to that of nickel foam, and it is ductile. It is suitable for producing catalysts, electromagnetic shields, and battery anodes.
The process is as follows: Techniques such as pre-treatment, chemical deposition, electrodeposition, combustion, and thermal reduction are used to create a three-dimensional porous structure with uniform distribution. The structure is formed by using an open-cell polyurethane sponge as a matrix.

Main feature

The density of open cell copper foam can be adjusted by varying the weight of the product, which can be manufactured with different porosity to meet the specific requirements of different application scenarios.
It is manufactured using the polyurethane sponge as the skeleton material, then plated with copper and finally sintered to form the open cell copper foam.

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Product parameter

Thickness	0.1-35mm
Aperture	0.1-10mm
Porosity	60-98%, can be customized
Through porosity	≥98%
Bulk density	0.1-3.0g/cm3, can be customized
PPI (number of holes per inch)	5-150
Size	Various sizes and shapes can be customized

Component Content
Element	Cu	Ni	Fe	S	C	Si
Guideline(ppm)	Balance	0.5~5%	≤100	≤80	≤100	≤50

copper foam metal

product key technologies

01.

The Substrate Electroplating Process

1. PU Sponge

2. Cleaning Treatment

3. Conductive treatment

4. Shearing and Electro-plating

5. Sintering

6. Porous metal foams

02.

Personalized Service

The material's filtration and flow characteristics can be precisely controlled due to its PPI range of 5 to 150 and pore size range of 0.1mm to 10mm. Our commitment is to provide customers with innovative, high-quality porous materials that meet a wide range of industrial and commercial needs. Our products deliver superior performance and durability.

Product feature and application

Open cell copper foam has a higher thermal conductivity than other metal foams (>180W/M.K). It is commonly used for heat conduction and dissipation in motors, electrical appliances, and electronic components.
Furthermore, the material offers high electrical conductivity, making it a popular choice as an electrode material for nickel-zinc batteries and electrical double layer capacitors.
Additionally, its three-dimensional structure makes it an excellent material for medical and water purification filters, while also being safe for human use.

Be used in a wide range of industries.

Conductive Device

Buffer Device

Heat Conducting Device

Electrode Material

Heat Exchanger

Heat Sink

Packing details

The open cell copper foam will be packed with waterproof paper or a weave bag and then placed into pallets or wooden cases.
Spool wire or ribbon products will be packed with plastic film and standard cardboard boxes before being placed into pallets or wooden cases.
We offer packaging solutions that can be tailored to meet our customers' specific requirements. Our team is equipped to select the most suitable transportation vehicles, taking into account the specific packing conditions.

product-1000-780

FAQ

do you have any question?

Can I get free samples?

If the sample is available, it can be provided for free. If the sample is unavailable, customization is required.

Can the products be customized?

All products can be customized to meet your specific requirements.

Are you a factory/manufacturer or a distributor?

We are a direct factory that owns production lines and employs workers. Our operations are flexible, and you do not need to worry about extra charges from middlemen or traders.

What is the delivery time after payment?

Usually it takes 3-5 days if the goods are in stock or 15-20 days if they are customized.