Brief introduction of foam copper

Copper foam is a novel multifunctional material composed of interconnected copper ligaments forming an open-celled and rigid three-dimensional network. Foamed copper has good mechanical properties and processing properties, excellent electrical and thermal conductivity, a large number of three-dimensional three-dimensional porous structures inside the material, and a large specific surface. Strength and ductility, and have good electromagnetic shielding and noise reduction and shock absorption. 

Copper foam can be widely used in heat dissipation and heat exchange materials of CPU, graphics cards, LED and other electronic components, phase change energy storage materials, buffering and shock absorption structural materials, lithium ion or fuel cell electrode materials, noise reduction materials, electromagnetic shielding materials, construction materials materials, various primary filters, catalysts and carriers, etc.