Benefits of Conductive Foams

Compressibility – Conductive foam can be compressed by more than 50% with minimal force, allowing it to fill gaps and provide reliable contact without putting strain on mating hardware.
Rebound and resiliency – When tested at 70°C, the ability to rebound to its original height and resistance to permanent deformation in the form of low compression set are outstanding.
EMI Shielding - Between the frequency ranges of 300 MHz and 10 GHz, 50 dB of attenuation equates to a more than 99% reduction in power transmission of interfering electrical fields.
Grounding and coupling - The surface resistivity of 0.12/SQ and the conductivity of X, Y, and Z provide a low resistance path for low amperage grounding currents to flow.
Dust Sealing - The microcellular structure prevents contaminants from entering and provides good sealing effectiveness.
Minimal Thickness for Compact Designs - A standard thickness of 0.021′′ allows for a low profile format for compact packages.
Shock and Vibration – Energy-absorbing formulation reduces vibration transmission and absorbs shock without breaking electrical contact.
PET Support - If necessary, a thin film layer provides dimensional support as well as a durable bearing surface.