Introduction of copper foam

Copper foam is a new multifunctional material, which is mainly produced by using copper as a substrate in which a large number of connected or unconnected holes are uniformly distributed.

Copper foam has good electrical conductivity and ductility, and the preparation cost is lower than that of nickel foam with good electrical conductivity, which can be used for the preparation of battery negative electrode (carrier) materials, catalyst carriers and electromagnetic shielding materials. In particular, copper foam has some obvious advantages as a substrate material for battery electrodes, but the corrosion resistance of copper is not as good as that of nickel, thus limiting its application in some fields.

Pure copper is a soft metal with an orange-red surface when first cut and a purplish-red color on its own. It is ductile and has high thermal conductivity, so it is the most commonly used material in cables, appliances, electronic components, and as a construction material, and can be composed of a variety of alloys.